Last week, PACK EXPO 2024 in Chicago, USA ended perfectly. Yixing Boya, the parent company of Qianrun, actively participated in this global packaging event as a flexible packaging enterprise.

At the PACK EXPO in Chicago, we not only presented our innovative technologies and diverse packaging solutions, but also had in-depth exchanges and discussions with industry leaders and customers from all over the world.

Our booth attracted many visitors who showed great interest in our environmentally friendly materials and customized services.