PackExpo, North America's premier packaging event, unpacks its doors, and Boya, the parent company of Qianrun, wraps up a grand entrance.
PACKEXPO, the largest and most comprehensive exhibition in North America this year, is hosted by the Packaging and Processing Technologies Association (PMMI). This expo stands tall among international packaging exhibitions, renowned for its professional influence. Scheduled from September 11th to 13th, the event showcases cutting-edge technologies in machinery, packaging, and processing. Over a thousand exhibitors have unveiled numerous new products and technologies, making it the most significant industry event of the year.
Yixing BOYA New Material Technology Co., Ltd., the parent company of Jiangsu Qianrun, boasts a wealth of experience in the packaging industry. As a distinguished Chinese exhibitor, we present a wide range of our star packaging products at this expo. Our products have attracted much attention, drawing many new visitor to stop and explore. Our team passionately introduced various innovative packaging products, attentively listened to customer needs, answered queries, and highlighted the unique features and advantages of our offerings. The sheer enthusiasm of our team members made our booth a hotspot of the event.
